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  november 2008 rev 3 1/16 16 stgb19nc60w STGP19NC60W, stgw19nc60w 19 a - 600 v - ultra fast igbt features high frequency operation low c res / c ies ratio (no cross-conduction susceptibility) applications high frequency motor cont rols, inverters, ups hf, smps and pfc in both hard switch and resonant topologies description this igbt utilizes the advanced powermesh? process resulting in an excellent trade-off between switching performance and low on-state behavior. figure 1. internal schematic diagram 1 2 3 to-220 to-247 1 2 3 1 3 d 2 pak table 1. device summary order codes marking package packaging stgb19nc60wt4 gb19nc60w d 2 pak tape and reel STGP19NC60W p19nc60w to-220 tube stgw19nc60w w19nc60w to-247 tube www.st.com
contents stgb19nc60w - STGP19NC60W - stgw19nc60w 2/16 contents 1 electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 3 test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4 package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 5 packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 6 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
stgb19nc60w - STGP19NC60W - stgw19nc60w electrical ratings 3/16 1 electrical ratings table 2. absolute maximum ratings symbol parameter value unit d 2 pak to-220 to-247 v ces collector-emitter voltage (v ge = 0) 600 v i c (1) 1. calculated according to the iterative formula: collector current (continuous) at t c = 25c 40 42 a i c (1) collector current (continuous) at t c = 100c 22 23 a i cl (2) 2. v clamp = 80% (v ces ), v ge = 15 v, r g = 10 ? , t j = 150 c turn-off latching current 30 a v ge gate-emitter voltage 20 v p tot total dissipation at t c = 25c 130 140 w t j operating junction temperature -65 to 150 c table 3. thermal resistance symbol parameter value unit d 2 pak to-220 to-247 r thj-case thermal resistance junction-case max 0.95 0.9 c/w r thj-amb thermal resistance junction-ambient max 62.5 50 c/w i c t c () t jmax () t c ? r thj c ? v ce sat () max () t jmax () i c t c () , () ---------------------------------------------------------------------------------------------------------- =
electrical characteristics stgb19nc60w - STGP19NC60W - stgw19nc60w 4/16 2 electrical characteristics (t case =25c unless otherwise specified) table 4. static symbol parameter test conditions min. typ. max. unit v (br)ces collector-emitter breakdown voltage (v ge = 0) i c = 1 ma 600 v v ce(sat) collector-emitter saturation voltage v ge = 15 v, i c = 12 a v ge = 15v, i c =12a, tc=125c 2.1 1.8 2.5 v v v ge(th) gate threshold voltage v ce = v ge , i c = 250 a 3.75 5.75 v i ces collector cut-off current (v ge = 0) v ce = 600 v v ce = 600 v, t c = 125c 150 1 a ma i ges gate-emitter leakage current (v ce = 0) v ge = 20 v 100 na g fs forward transconductance v ce = 15 v , i c = 12 a 10 s table 5. dynamic symbol parameter test conditions min. typ. max. unit c ies c oes c res input capacitance output capacitance reverse transfer capacitance v ce = 25 v, f = 1mhz, v ge = 0 1180 130 26 pf pf pf q g q ge q gc total gate charge gate-emitter charge gate-collector charge v ce = 390 v, i c = 12 a, v ge = 15 v, figure 16 53 10 21 nc nc nc
stgb19nc60w - STGP19NC60W - stgw19nc60w electrical characteristics 5/16 table 6. switching on/off (inductive load) symbol parameter test conditions min. typ. max. unit t d(on) t r (di/dt) on turn-on delay time current rise time turn-on current slope v cc = 390 v, i c = 12 a r g = 10 ? , v ge = 15 v, figure 17 25 7 1600 ns ns a/s t d(on) t r (di/dt) on turn-on delay time current rise time turn-on current slope v cc = 390 v, i c = 12 a r g = 10 ? , v ge = 15 v, t c = 125c figure 17 25 8 1400 ns ns a/s t r (v off ) t d ( off ) t f off voltage rise time turn-off delay time current fall time v cc = 390 v, i c = 12 a r g = 10 ? , v ge = 15 v, figure 17 22 90 43 ns ns ns t r (v off ) t d ( off ) t f off voltage rise time turn-off delay time current fall time v cc = 39 0v, i c = 12 a r g = 10 ? , v ge = 15 v, t c = 125c figure 17 47 127 77 ns ns ns table 7. switching energy (inductive load) symbol parameter test conditions min. typ. max. unit e on (1) e off (2) e ts 1. eon is the turn-on losses when a typical diode is used in the test circuit in figure 15 if the igbt is offered in a package with a co-pak diode, the co-pack diode is used as external diode. igbts & diode are at the same temperature (25c and 125c) 2. turn-off losses include also the tail of the collector current turn-on switching losses turn-off switching losses total switching losses v cc = 390 v, i c = 12 a r g = 10 ? , v ge = 15 v, figure 17 81 125 206 j j j e on (1) e off (2) e ts turn-on switching losses turn-off switching losses total switching losses v cc = 390 v, i c = 12 a r g = 10 ? , v ge = 15 v, t c = 125c figure 17 161 255 416 j j j
electrical characteristics stgb19nc60w - STGP19NC60W - stgw19nc60w 6/16 2.1 electrical characteri stics (curves) figure 2. output characteristics figure 3. transfer characteristics figure 4. transconductance figure 5. collector-emitter on voltage vs temperature figure 6. gate charge vs gate-source voltage figure 7. capacitance variations
stgb19nc60w - STGP19NC60W - stgw19nc60w electrical characteristics 7/16 figure 8. normalized gate threshold voltage vs temperature figure 9. collector-emitter on voltage vs collector current figure 10. normalized breakdown voltage vs temperature figure 11. switching losses vs temperature figure 12. switching losses vs gate resistance figure 13. switching losses vs collector current
electrical characteristics stgb19nc60w - STGP19NC60W - stgw19nc60w 8/16 figure 14. turn-off soa
stgb19nc60w - STGP19NC60W - stgw19nc60w test circuit 9/16 3 test circuit figure 15. test circuit for inductive load switching figure 16. gate charge test circuit figure 17. switching waveform
package mechanical data stgb19nc60w - STGP19NC60W - stgw19nc60w 10/16 4 package mechanical data in order to meet environmental requirements, st offers these devices in ecopack? packages. these packages have a lead-free second level interconnect. the category of second level interconnect is marked on the package and on the inner box label, in compliance with jedec standard jesd97. the maximum ratings related to soldering conditions are also marked on the inner box label. ecopack is an st trademark. ecopack specifications are available at: www.st.com
stgb19nc60w - STGP19NC60W - stgw19nc60w package mechanical data 11/16 d2pak (to-26 3 ) mechanical data dim mm inch min typ max min typ max a 4.40 4.60 0.17 3 0.1 8 1 a1 0.0 3 0.2 3 0.001 0.00 9 b 0.70 0. 93 0.027 0.0 3 7 b 2 1.14 1.70 0.045 0.067 c 0.45 0.60 0.017 0.024 c2 1.2 3 1. 3 60.04 8 0.05 3 d 8 . 9 5 9 . 3 50. 3 52 0. 3 6 8 d1 7.50 0.2 9 5 e 10 10.40 0. 39 40.40 9 e1 8 .50 0. 33 4 e 2.54 0.1 e1 4. 88 5.2 8 0.1 9 20.20 8 h15 15. 8 50.5 9 00.624 j1 2.4 9 2.6 9 0.0 99 0.106 l2.2 9 2.7 9 0.0 9 0 0.110 l1 1.27 1.40 0.05 0.055 l2 1. 3 0 1.75 0.051 0.06 9 r 0.4 0.016 v2 0 8 0 8 0079457_m
package mechanical data stgb19nc60w - STGP19NC60W - stgw19nc60w 12/16 to-220 mechanical data dim mm inch min typ max min typ max a 4.40 4.60 0.17 3 0.1 8 1 b 0.61 0. 88 0.024 0.0 3 4 b 1 1.14 1.70 0.044 0.066 c0.4 8 0.70 0.01 9 0.027 d 15.25 15.75 0.6 0.62 d1 1.27 0.050 e 10 10.40 0. 393 0.40 9 e 2.40 2.70 0.0 9 4 0.106 e1 4. 9 5 5.15 0.1 9 4 0.202 f1.2 3 1. 3 2 0.04 8 0.051 h1 6.20 6.60 0.244 0.256 j1 2.40 2.72 0.0 9 4 0.107 l1 3 14 0.511 0.551 l1 3 .50 3 . 93 0.1 3 7 0.154 l20 16.40 0.645 l 3 02 8 . 9 0 1.1 3 7 ? p 3 .75 3 . 8 5 0.147 0.151 q2.65 2. 9 5 0.104 0.116
stgb19nc60w - STGP19NC60W - stgw19nc60w package mechanical data 13/16 dim. mm. min. typ max. a4. 8 55.15 a1 2.20 2.60 b 1.0 1.40 b 1 2.0 2.40 b 2 3 .0 3 .40 c0.40 0. 8 0 d1 9 . 8 5 20.15 e 15.45 15.75 e5.45 l 14.20 14. 8 0 l1 3 .70 4. 3 0 l2 1 8 .50 ?p 3 .55 3 .65 ?r 4.50 5.50 s 5.50 to-247 mechanical data
packaging mechanical data stgb19nc60w - STGP19NC60W - stgw19nc60w 14/16 5 packaging mechanical data tape and reel shipment d 2 pak footprint dim. mm inch min. max. min. max. a 33 0 12.992 b 1.5 0.059 c12. 8 1 3 .2 0.504 0.520 d 20.2 0795 g 24.4 26.4 0.960 1.0 3 9 n 100 3 .9 3 7 t 3 0.4 1.197 ba s e qty bulk qty 1000 1000 reel mechanical data dim. mm inch min. max. min. max. a0 10.5 10.7 0.41 3 0.421 b0 15.7 15.9 0.61 8 0.626 d 1.5 1.6 0.059 0.06 3 d1 1.59 1.61 0.062 0.06 3 e1.651. 8 5 0.065 0.07 3 f 11.4 11.6 0.449 0.456 k0 4. 8 5.0 0.1 8 9 0.197 p0 3 .9 4.1 0.15 3 0.161 p1 11.9 12.1 0.46 8 0.476 p2 1.9 2.1 0.075 0.0 8 2 r 50 1.574 t0.250. 3 5 0.009 8 0.01 3 7 w 2 3 .7 24. 3 0.9 33 0.956 tape mechanical data
stgb19nc60w - STGP19NC60W - stgw19nc60w revision history 15/16 6 revision history table 8. document revision history date revision changes 04-oct-2006 1 initial release. 08-may-2007 2 modified value on table 2 20-nov-2008 3 inserted packages: d 2 pak and to-247
stgb19nc60w - STGP19NC60W - stgw19nc60w 16/16 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2008 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com


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